Atttaching leads to integrated-circuit chips

Details Atttaching leads to integrated-circuit chips Atttaching leads to integrated-circuit chips

H - Electricity

01

L

26/139

H01L 21/603 (2006.01)

Patent

CA 1088282

Abstract Of The Disclosure Coupling of the end portion of a continuous conductive filament to an element mountable at a work station is attained in accordance with the method and apparatus of the instant invention by emplacing the conductive filament from a feed means so that the end portion of the conductive filament is congruent with a predetermined geometric location, and arranging the feed means relative to the work station so that the geometric locus defined by the position of the emplaced conductive filament is predetermined and repeatable. Advantageously, the continuous conductive filament may be emplaced by pushing or pulling. The end portion is thereafter joined to a predetermined terminal area on an element which is coextensive with the predetermined geometric location. Preferably, the conductive filament is subsequently joined to a second terminal area then cut or broken to form a permanent or temporary package. Moreover, in the preferred embodiment of the invention a plurality of continuous conductive filaments are initially joined in a gang to predetermined areas of the element and subsequently to predetermined terminal areas of a carrier member to form a permanent or temporary package.

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