Automated hybrid circuit board assembly apparatus

Details Automated hybrid circuit board assembly apparatus Automated hybrid circuit board assembly apparatus

H - Electricity

01

L

356/194

H01L 21/70 (2006.01) H01L 21/683 (2006.01)

Patent

CA 1102927

TITLE: AUTOMATED HYBRID CIRCUIT BOARD ASSEMBLY APPARATUS ABSTRACT OF THE DISCLOSURE An apparatus for placement of electronic components on a fluxed hybrid circuit substrate. In accordance with an automated program, the apparatus at a single work station places with high precision a plurality of chips of various types and physical and electrical sizes on a single substrate. Components are successively placed by a pair of hollow pick and placement spindles operating alternately and having motion in the X-Y planes. Precise location of stored chips is not required; the apparatus orients and centers each chip after selection and prior to placement.

307706

Affiliated with

Also associated with

Rating

Automated hybrid circuit board assembly apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Automated hybrid circuit board assembly apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Automated hybrid circuit board assembly apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-444089