Automatic adjustment method for elimination of the centering...

Details Automatic adjustment method for elimination of the centering... Automatic adjustment method for elimination of the centering...

G - Physics

01

R

G01R 31/28 (2006.01)

Patent

CA 2230211

An automatic adjustment method is described for elimination of the centering error during the electrical test on printed circuit boards, in particular SMT (surface mounting technology) printed circuit boards, in which metal surface bump contacts or pads are used for connection of the components to the PCB, the method comprising the following steps: - association of a centering profile p=f(.theta.) with 0 ~ .theta. < 360°, to each pad; performance of an electrical test and classification of the pads as open and ok; determination of the ~ max and ~min curves, respectively the lower envelope of the centering profiles of the ok pads, and the upper envelope of the pads found to be open; determination of the zone A of possible displacements of the test needles with respect to the nominal points of contact between needles and pads; determination of the optimal correction ~opt, .theta.opt; operation of the control means to carry out this optimal correction.

L'invention est une méthode d'ajustement automatique servant à éliminer l'erreur de centrage durant les tests électriques des cartes à circuit imprimé, en particulier des cartes à composants montés en surface, sur lesquelles des plots de contact métalliques sont utilisés pour la connexion des composants sur ces cartes. La méthode de l'invention comporte les opérations suivantes : affectation à chaque plot d'un profil de centrage p = f( ) où 0 ~ < 360 degrés; exécution d'un test électrique et classification des plots en plots ouverts et en plots acceptés; détermination des courbes ~max et ~min qui sont respectivement l'enveloppe inférieure des profils de centrage des plots acceptés et l'enveloppe supérieure des plots ouverts; détermination de la zone A des déplacements possibles des pointes de test par rapport aux points de contact nominaux entre ces pointes et les plots; détermination de la correction optimale ~opt, opt; et utilisation du dispositif de commande pour effecteur cette correction optimale.

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