H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/22, 356/8
H05K 13/04 (2006.01) H05K 13/08 (2006.01)
Patent
CA 1221471
AUTOMATIC IC MOUNTING PROCESS AND APPARATUS FOR PERFORMING THE PROCESS ABSTRACT OF THE DISCLOSURE An automatic IC mounting process for mounting a plurality of ICs on an upper surface of a printed circuit board in accordance with a predetermined sequence program. Each of the ICs has a plurality of leads, each of which is to be inserted into a predetermined corre- sponding through-hole of the printed circuit board. The process includes: (i) a step for inserting the leads of an IC into the through-holes of the printed circuit board; (ii) a step for detecting whether or not each lead of the IC is correctly inserted into the corre- sponding through-hole after every step (i); (iii) a step for removing a misinserted IC having a misinserted lead from the printed circuit board and discarding the misinserted IC into a predetermined reject place immediately after a misinsertion is detected in the step (ii); (iv) a step for memorizing the information for identifying the misinserted IC; (v) a step for mounting a predetermined number of subsequent ICs on the printed circuit board in accordance with the prede- termined sequence program, leaving the position of the misinserted IC unmounted; (vi) a step for searching for whether or not the information was memorized in the step (iv); and, (vii) a step for preparing a new IC identified by that information and remounting it on the printed circuit board at the position of the mis- inserted IC.
471215
Arase Fumio
Hino Toshikatsu
Ohshima Takashi
Fujitsu Limited
Mcfadden Fincham
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