Automatic lead wire tinning of tape-packaged components

Details Automatic lead wire tinning of tape-packaged components Automatic lead wire tinning of tape-packaged components

B - Operations, Transporting

05

C

113/87

B05C 3/02 (2006.01)

Patent

CA 1268997

ABSTRACT OF THE INVENTION In combination, a wave station establishing a wave of liquid solder having a convex configuration transverse to an axis which decreases in cross-sectional area with distance along the axis, apparatus transporting along the axis an electrical component having at least one linear conductor extending transverse to the axis to pass through the wave of solder, and heating and suction apparatus for removing excess solder from the conductor.

497081

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