Automatic wafer focusing and flattening system

Details Automatic wafer focusing and flattening system Automatic wafer focusing and flattening system

H - Electricity

01

L

356/194, 342/22.

H01L 21/68 (2006.01) G01S 15/88 (2006.01) G03F 9/00 (2006.01) G05D 3/14 (2006.01)

Patent

CA 1157128

EO-2627 AUTOMATIC WAFER FOCUSING AND FLATTENING SYSTEM ABSTRACT An automatic focusing system for positioning silicon or other wafer within the focal plane of a photolithographic mask projection system. The position of the wafer is measured at a plurality of points and compared to the position of an optical flat located in the focal plane to provide signals for positioning the wafer at the focal plane of the projection system. The system also includes means for changing the contours of the wafer to cause it to lie in a known plane.

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