Autonomous selective cutting, method and apparatus

Details Autonomous selective cutting, method and apparatus Autonomous selective cutting, method and apparatus

B - Operations, Transporting

26

D

B26D 5/00 (2006.01) B23Q 15/04 (2006.01) G05B 19/42 (2006.01)

Patent

CA 2135620

2135620 9322736 PCTABS00027 Real time in-process data is collected to determine the contour and position of the interface between dissimilar layers of material. A control system (4) is automatically programmed, based on the determined contour and position of the interface, to automatically control the trajectory of a cutter (30) through a conventional motion control system to separate the dissimilar layers of material. The motion control system controls the cutter movement through, for example, a conventional linear motion device including a servomotor (12), lead screw (32), and slidable carriage (10) that holds the cutter (30).

Affiliated with

Also associated with

Rating

Autonomous selective cutting, method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Autonomous selective cutting, method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Autonomous selective cutting, method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1750569