Backpanel having multiple logic family signal layers

Details Backpanel having multiple logic family signal layers Backpanel having multiple logic family signal layers

H - Electricity

05

K

356/1

H05K 1/02 (2006.01) G06F 13/40 (2006.01) H05K 9/00 (2006.01) H05K 1/00 (2006.01)

Patent

CA 2011933

BACKPANEL HAVING MULTIPLE LOGIC FAMILY SIGNAL LAYERS Abstract of the Disclosure A printed circuit board backpanel uses strip- line construction to allow emitter coupled logic (ECL) busses and transistor-transistor logic (TTL) busses on the same signal layer, while providing electromagnetic interference (EMI) emission control.

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