Ball grid array with x-ray alignment mark

Details Ball grid array with x-ray alignment mark Ball grid array with x-ray alignment mark

H - Electricity

01

L

H01L 23/544 (2006.01) H01L 21/60 (2006.01) H01L 23/498 (2006.01) H05K 1/02 (2006.01) H05K 3/30 (2006.01)

Patent

CA 2433488

An apparatus and method for inspecting electronic component orientation along with x-ray verification of connection integrity is presented. An exemplary method comprises providing an electronic component 100 for surface mount integration and providing an x-ray visible orientation indicator 300, 402, 500, 600 for the electronic component 100 such that proper orientation of the electronic component 100 is verifiable by x-ray inspection after performing surface mount integration of the electronic component. The x-ray inspection also makes connection integrity of the electronic component 100 verifiable.

L'invention porte sur un appareil et un procédé d'examen de l'orientation de composants électroniques et de vérification de l'intégrité de leurs connexions. Le procédé donné en exemple utilise un composant électronique (100) monté en surface et un indicateur d'orientation (300, 402, 500, 600) du composant électronique (100) visible aux rayons X permettant de vérifier aux rayons X l'orientation correcte du composant électronique (100) après son montage en surface ainsi que l'intégrité de ses connexions.

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