H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/135
H01L 23/28 (2006.01) H01L 21/60 (2006.01) H01L 23/485 (2006.01) H05K 3/40 (2006.01)
Patent
CA 1259425
ABSTRACT OF THE DISCLOSURE Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB sheets and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packaging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip and an MLC package. Area TAB tape, which comprises a modifi- cation of TAB tape provides balltape TAB connections by means of balltape bonds to areas within the interior of a chip whose leads are bonded in a TAB tape ar- rangement to the Inner Lead Bonds of the area tape.
532515
Hodgson Rodney T.
Jones Harry J.
Ledermann Peter G.
Moskowitz Paul A.
Reiley Timothy C.
International Business Machines Corporation
Saunders Raymond H.
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