Barrier layer and orifice plate for thermal ink jet print...

Details Barrier layer and orifice plate for thermal ink jet print... Barrier layer and orifice plate for thermal ink jet print...

B - Operations, Transporting

41

J

101/96.022

B41J 2/01 (2006.01) B21D 53/00 (2006.01) C25D 1/02 (2006.01) G03C 5/00 (2006.01) H01L 21/306 (2006.01)

Patent

CA 1303903

ABSTRACT This application discloses a thermal ink jet print head and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly. This assembly includes constricted ink flow ports to reduce cavi- tation damage and smooth contoured convergent ink ejection orifices to prevent "gulping" of air during an ink ejection process. Both of these features extend the maximum operating frequency, fmax, of the printhead. The nickle barrier layer and the underlying thin film resistor sub- strate are gold plated and then soldered together to form a good strong solder bond at the substrate - barrier layer interface.

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