Barrierless high-temperature lift-off process

Details Barrierless high-temperature lift-off process Barrierless high-temperature lift-off process

H - Electricity

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H01L 21/28 (2006.01) H01L 21/027 (2006.01) H01L 21/311 (2006.01) H01L 21/768 (2006.01) H05K 3/14 (2006.01)

Patent

CA 1223089

ABSTRACT A lift-off metal deposition process in which a high temperature polyimide layer (i.e. a polyimide having a high imidization temperature) is applied to a first polyimide layer. The two layers are anisotropically etched through a photoresist mask to form vias in the first polyimide layer. After application of a metal layer, the high-temperature polyimide layer is lifted off the first polyimide layer, which remains as a passivation layer.

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