Bath and method of electroless plating of silver on metal...

C - Chemistry – Metallurgy – 23 – C

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C23C 18/42 (2006.01) H05K 3/24 (2006.01)

Patent

CA 2417071

Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a metho of elctroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for AG+ ions.

Les procédés connus d'amélioration de la capacité de soudure de surfaces de cuivre sur des cartes de circuits imprimés présentent les désavantages de l'irrégularité d'épaisseur des couches extérieures au niveau des surfaces métalliques, du coût élevé de ces couches ou de la nocivité pour l'environnement des constituants utilisés dans la fabrication. De plus, ces surfaces métalliques doivent être adaptées à la création de connexions, ainsi que de contacts électriques. L'invention permet de résoudre ces problèmes au moyen d'un bain et d'un procédé de dépôt autocatalytique d'argent par l'intermédiaire d'une réaction échangeuse de charges sur les surfaces de métaux moins nobles que l'argent, plus particulièrement, de cuivre, contenant au moins un complexe d'halogénure d'argent et ne contenant aucun agent réducteur des ions Ag?+¿.

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