Bath for the electrodeposition of gold

Details Bath for the electrodeposition of gold Bath for the electrodeposition of gold

C - Chemistry, Metallurgy

25

D

204/29

C25D 3/48 (2006.01)

Patent

CA 1053174

ABSTRACT OF THE DISCLOSURE A cyanide-free bath for the electrodeposition of gold includes a conductive salt such as the ammonium or alkali metal salt of an inorganic or weak organic acid, e.g., sulphuric, sulphurous, carbonic, boric, sulphamic, acetic or citric acid; and gold in the form of a thiosulphato-complex in a concentration of 3 to 30 g/litre, the complex being sodium dithiosulphato- aurate (I) or sodium heptathiosulphato-aurate (I). The bath may also contain, as a reducing agent, an alkali metal nitrite or sulphite, and, as a buffer or pH regulator, sodium borate, potas- sium metabisulphite or a mixture of boric acid and ethylene glycol.

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