Battery pack and method of forming same

H - Electricity – 01 – M

Patent

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Details

H01M 2/02 (2006.01) B29C 65/08 (2006.01) H01M 2/10 (2006.01) H01M 10/04 (2006.01)

Patent

CA 2148127

A battery pack containing a battery of cells includes an outer casing (402) adapted to receive a battery of cells (404); a bonding surface (410) positioned along the outer casing (402); an inner casing (408) adapted to encapsulate the battery of cells (404) and having a surface for bonding to the bonding surface of the outer casing (402); and a bond provided at the bonding surface to bond the inner casing (408) to the outer casing (402). Also, a method for forming a battery pack comprises steps of positioning a battery of cells within a bonding surface of an outer casing of the battery pack; encapsulating the battery of cells with an inner casing, the inner casing having a surface corresponding to the bonding surface of the outer casing; and bonding the corresponding surface of the inner casing to the bonding surface of the outer casing. The battery pack and method for forming the battery pack reduce the weight and complexity in manufacturing.

Un ensemble à piles contenant un groupe d'éléments comprend un boîtier externe (402) conçu pour recevoir un groupe d'éléments (404); une surface de liaison (410) positonnée le long du boîtier externe (402); un boîtier interne (408) conçu pour encapsuler le groupe d'éléments (404) et comportant une surface se raccordant à la surface de liaison afin de raccorder le boîtier interne (408) au boîtier externe (402). L'invention concerne également un procédé d'assemblage d'un ensemble à piles qui consiste à positioner un groupe d'éléments à l'intérieur d'une surface de liaison d'un boîtier externe de l'ensemble à piles; à encapsuler le groupe d'éléments avec un boîtier interne, celui-ci possédant une surface correspondant à la surface de liaison du boîtier externe; et à raccorder la surface correspondante du boîtier interne à la surface de liaison du boîtier externe. L'ensemble à piles et son procédé d'assemblage réduisent le poids du dispositif et la complexité du processus de fabrication.

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