Bead-like expandable molding materials having high heat...

Details Bead-like expandable molding materials having high heat... Bead-like expandable molding materials having high heat...

C - Chemistry, Metallurgy

08

J

403/80

C08J 9/16 (2006.01) C08J 9/00 (2006.01) C08J 9/20 (2006.01)

Patent

CA 2008921

- 8 - O.Z. 0050/40577 Abstract of the Disclosure: Bead-like expandable molding materials having high heat distortion resistance contain from 80 to 99% by weight of a styrene polymer, from 1 to 20% by weight of poly-(2,6-dimethyl)-1,4-diphenylene ether and from 3 to 10% by weight of a C3-C8-hydrocarbon as a blowing agent and may contain conventional addi- tives. They are obtained by suspension polymerization of a solution of the polyphenylene ether in styrene.

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