Beam radiation curing of adhesives for flocking on...

Details Beam radiation curing of adhesives for flocking on... Beam radiation curing of adhesives for flocking on...

B - Operations, Transporting

05

D

204/91.33, 204/9

B05D 1/16 (2006.01) B05D 3/06 (2006.01) C09J 5/00 (2006.01)

Patent

CA 1052320

Abstract of Disclosure The disclosure herein is concerned with critical electron-beam radiation parameters and beam-passage rates and ajustments that have been found to enable high-speed curing of adhesives used to bond flock and similar materials to heat- sensitive substrates that otherwise inherently limit the degree of thermal curing that may be employed as by other means, and consequently limit the speed of curing.

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