Bending spring joint and process for its production

Details Bending spring joint and process for its production Bending spring joint and process for its production

F - Mech Eng,Light,Heat,Weapons

16

C

267/110

F16C 11/12 (2006.01) F16F 1/18 (2006.01)

Patent

CA 1323639

- 1 - Abstract: The present invention relates to a micromechanical bending spring joint of selectively etched silicon wafer material. The joint consists of two leaf springs arranged alongside each other, crossing and running obliquely with respect to the main areas of the wafer. The joint is obtained in one piece from the wafer by selective etching. The bending spring joint is characterized by high precision with regard to fulcrum position, bending spring constant and by high transverse axis rigidity.

556935

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