B - Operations – Transporting – 24 – B
Patent
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B24B 49/00 (2006.01) B24B 1/00 (2006.01) B24B 41/06 (2006.01) B24B 49/10 (2006.01) H05K 3/00 (2006.01) H05K 1/02 (2006.01) H05K 3/42 (2006.01)
Patent
CA 1300889
Applicants: Dawson et al. For: Biased Grinding Assembly ABSTRACT OF THE DISCLOSURE A grinding assembly for grinding an object such as a printed circuit board coupon at a predetermined angle and to a predetermined grinding depth, including a control board carrying a grinding guide having at least two conductive leads and a conductive control track interconnecting the conductive leads, and a shelf having an upper surface for supporting the object. The shelf is positioned relative to the control board to establish a grinding surface for the object biased at the predetermined angle. The shelf is further positioned to align the predetermined grinding depth of the object with a portion of the rear edge of the control track so that the track is ground through when the object is ground along the biased grinding surface to the predetermined grinding depth.
554781
Dawson Thomas F.
Ewing Paul C. Jr.
Dawson Thomas F.
Ewing Paul C. Jr.
Fetherstonhaugh & Co.
Stark (charles) Draper Laboratory Inc. (the)
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