Bilevel ultraviolet resist system for patterning substrates...

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356/177

H01L 21/02 (2006.01) G03F 7/095 (2006.01)

Patent

CA 1194615

- 15 - BILEVEL ULTRAVIOLET RESIST SYSTEM FOR PATTERNING SUBSTRATES OF HIGH REFLECTIVITY Abstract A bilevel photoresist system 10 of two organic photoresists, both sensitive to deep ultraviolet (UV) radiation from the same deep UV source (e.g., Xe-Hg) and suitable for use in patterning a substrate of high reflectivity in the deep UV, comprises a top layer of a negative photoresist (e.g., the azide-phenolic resin diazidodiphenyl sulfone mixed into poly(p-vinylphenol) having a thickness of about 0.5 micron, and a bottom layer of positive photoresist (e.g., po]ymethyl methacrylate), having a thickness about 1 or 2 microns. The top layer is thus of sufficient thickness to be substantially opaque to the deep UV radiation from the source. The top layer is patterned by projecting the deep UV light to form an image therein which is complementary to the ultimately desired pattern, followed by treating the top layer, with a suitable solvent which attacks and removes the unexposed portions thereof. Then the bottom layer is patterned by directing a collimated (parallel) beam from the deep UV source onto the bottom layer, using the thus patterned top layer as a shadow mask, followed by treating the bottom layer with a suitable solvent which attacks and removes the portions of the bottom layer thus previously exposed to the UV light. Then the thus patterned photoresist layers can be used as a protective mask for etching the top surface of the substrate in accordance with the desired pattern.

444441

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Bilevel ultraviolet resist system for patterning substrates... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bilevel ultraviolet resist system for patterning substrates..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bilevel ultraviolet resist system for patterning substrates... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1189125

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.