C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
18/1010, 154/131
C08L 97/02 (2006.01) B32B 21/02 (2006.01) C08L 75/08 (2006.01) B29J 5/00 (1980.01)
Patent
CA 1092263
ABSTRACT OF THE DISCLOSURE: Molding composition suitable forming a shaped article comprises wood particles having about 2 to about 20% by weight moisture based upon the dry weight of the wood particles and a binder composition capable of being crosslinked coated onto the wood particles and present in the proportion of about 0.5 to about 50% based upon the dry weight of said wood particles, the binder consisting essentially of the mixture of an organic polyisocyanate and 0.5 to about one equivalent weight of a polyether polyol based upon one equivalent weight of the organic polyisocyanate, the polyol having a functionality greater than 2; the molding composition contains no catalyst and is used in the absence of a mold-release agent. Consolidation of wood particles into a particle board when accomplished using the molding composition of the invention and metal mold face takes place with substantially reduced adhesion to metal mold parts as compared to a similar use of prior art binders comprising an organic polyisocyanate. It is thus possible to achieve faster production cycles and thereby effect economies over processes of the prior art in the produc- tion of wood particle board which can contain besides binder and wood particles the usual commercial additives to protect the particles board against destruction by fungi, insects or fire.
279625
Basf Wyandotte Corporation
Robic Robic & Associes/associates
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