C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 18/62 (2006.01) B27N 3/00 (2006.01) C08G 18/64 (2006.01) C08L 75/04 (2006.01) C08L 97/02 (2006.01)
Patent
CA 2312894
An isocyanate-base binder composition for use in a process for manufacturing hot-press molded boards from lignocellulose and inorganic material as the principal feedstock, wherein the releasability of boards from a hotplate is well kept for long and the system productivity is remarkably improved, thus providing boards excellent in various properties and reduced in the coefficient of expansion due to moisture absorption. The binder composition contains a compound (A) having at least two isocyanate groups, a low-molecular- weight polyethylene (B) and water (C) as the essential components.
L'invention concerne une composition de liant à base d'isocyanate destinée à s'utiliser dans un procédé de fabrication de panneaux moulés par pressage à chaud de matières premières composées de lignocellulose et de matière inorganique. La composition permet de garder libérables pendant longtemps les panneaux d'une presse à chaud et d'améliorer de façon remarquable la productivité du système, ce qui permet de produire des panneaux possédant d'excellentes propriétés et de réduire leur coefficient de dilatation due à une absorption d'humidité. La composition de liant contient, comme composants essentiels, un composé (A) possédant au moins deux groupes isocyanates, un polyéthylène (B) à faible poids moléculaire et de l'eau (C).
Hokonohara Hisashi
Ito Takeshi
Sakaguchi Hiroaki
Sugawara Masaki
Takahashi Akihiro
Mitsui Chemicals Incorporated
Sim & Mcburney
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