Binder compositions comprising low molecular weight poly...

Details Binder compositions comprising low molecular weight poly... Binder compositions comprising low molecular weight poly...

C - Chemistry, Metallurgy

08

L

117/189, 261/25,

C08L 61/06 (2006.01) C08G 8/24 (2006.01) C08K 3/00 (2006.01) C08K 3/22 (2006.01) C08K 5/13 (2006.01) C08K 13/02 (2006.01)

Patent

CA 1335679

The invention relates to a binder composition comprising a low molecular weight poly (orthomethylolated) phenolic compound which is combined with a phenol formaldehyde novolac resin and cured in the presence of alkali and an organic ester. Low and high density aggregates can be added to the binder to produce foundry or refractory articles. The binder can also be applied, with or without aggregate, to paper, fabrics, or concrete.

609831

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