C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
22/108, 22/159,
C08K 5/04 (2006.01) B22C 1/22 (2006.01) C08G 8/04 (2006.01) C08G 18/54 (2006.01) C08J 3/09 (2006.01) C08K 5/52 (2006.01) C08L 61/06 (2006.01)
Patent
CA 1122737
Abstract of the Disclosure There are provided binder compositions particularly useful in the foundry art which are rapid curing and which comprise (A) a phenolic resin component including at least one resole or novolak resin, solvent comprising a mixture of (1) hy- drocarbon solvent and (2) polar organic solvent containing at least sufficient organic phosphate and/or carbonate ester to increase the curing speed and solubility of the phenolic resin component, (B) an isocyanate component having a functionality of two or more and (C) sufficient catalyst to catalyze substantially completely the reaction between components (A) and (B). There is also provided a moldable composition comprising aggregate material, such as foundry sand, and such binder com- positions and foundry cores or molds made therefrom and including a process for their manufacture from the moldable compositions by either "cold box" or "no-bake" procedures.
321488
Cpc International Inc.
Ridout & Maybee Llp
LandOfFree
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