Bipolar plating of metal contacts onto oxide interconnection...

Details Bipolar plating of metal contacts onto oxide interconnection... Bipolar plating of metal contacts onto oxide interconnection...

H - Electricity

01

M

319/1, 204/24

H01M 8/00 (2006.01) C25D 5/54 (2006.01) C25D 7/04 (2006.01) H01M 8/02 (2006.01) H01M 8/24 (2006.01)

Patent

CA 1270896

ABSTRACT OF THE INVENTION Disclosed is a method of forming an adherent metal deposit on a conducting layer of a tube sealed at one end. The tube is immersed with the sealed end down into an aqueous solution containing ions of the metal to be depos- ited. An ionically conducting aqueous fluid is placed inside the tube and a direct current is passed from a cathode inside the tube to an anode outside the tube. Also disclosed is a multi-layered solid oxide fuel cell tube which consists of an inner porous ceramic support tube, a porous air electrode covering the support tube, a non- porous electrolyte covering a portion of the air electrode, a non-porous conducting interconnection covering the remaining portion of the electrode, and a metal deposit on the interconnection.

495703

Affiliated with

Also associated with

Rating

Bipolar plating of metal contacts onto oxide interconnection... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bipolar plating of metal contacts onto oxide interconnection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bipolar plating of metal contacts onto oxide interconnection... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1287299