Bis-maleimide resin composition

C - Chemistry – Metallurgy – 08 – G

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402/219, 400/770

C08G 69/00 (2006.01) C08G 73/12 (2006.01)

Patent

CA 1263495

BIS-MALEIMIDE RESIN COMPOSITION ABSTRACT OF THE DISCLOSURE A novel bis-imide matrix resin composition comprising (i) 40 to 95 percent by weight of ethylene- ically unsaturated bis-imides, preferrably a low melting mixture of a major portion of maleimides of aromatic amines such as toluene diamine and methylene dianiline with a minor portion of maleimide of an aliphatic amine such as trimethyl hexamethylene diamine, (ii) 5 percent to 60 percent by weight of a heatactivatible cross- linking agent combination for gelling the bis-imides, said combination comprising (1) an arylene polyamine and (2) an alkenylphenol or alkenylphenol ether, and, as a polymerization catalyst therefor, (iii) an imidazole compound. The resin composition is useful as a matrix resin for high performance, fiber reinforced composites, having low shrinkage, good thermal stability and moisture resistance and excellent impact strength.

500393

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