Bismaleimides and prepreg resins therefrom

Details Bismaleimides and prepreg resins therefrom Bismaleimides and prepreg resins therefrom

C - Chemistry, Metallurgy

07

D

402/270, 402/297

C07D 207/452 (2006.01) C07D 209/48 (2006.01) C08G 59/44 (2006.01) C08G 73/12 (2006.01) C08J 5/24 (2006.01)

Patent

CA 1236466

BISMALEIMIDES AND PREPREG RESINS THEREFROM I ABSTRACT OF THE DISCLOSURE Described herein are novel bismaleimides and prepregable resin compositions comprising these bismale- imides and one or more liquid coreactants and optionally, one or more other additives. In accordance with the present disclosure there are compositions including (i) bismaleimides of formula (II), Image II wherein n is 0 to 4, preferably 0 to 2, and R is the residuum of a dihydric phenol, such as resorcinol, bis- phenol A, hydroquinone, 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxy-3,3',5,5'-tetramethyldiphenyl sulfone, 4,4'-dihydroxybenzophenone, 3,3',5,5'-tetramethylbis- phenol A, 3,4'-dihydroxybenzophenone, 4,4'-diphenol, chlorohydroquinone, methylhydroquinone and the like; and (ii) prepregable resin compositions comprising II and one or more liquid coreactants and optionally, other additives. These compositions may optionally contain a structural fiber as well.

470150

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