C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 222/40 (2006.01) C08G 73/12 (2006.01)
Patent
CA 2597652
The present invention is for the use of aliphatic bismaleimide compounds in epoxy resin systems to increase the thermal aging properties of a cured resin system through reduced microcracking as measured by reduced weight loss after thermal aging. The present invention further provides a BMI resin formulation with no undissolved solid BMI, but which retains equivalent mechanical properties as BMI resin formulations incorporating slurried solid BMI particles.
La présente invention porte sur l'utilisation de composés bismaleimide aliphatique dans des systèmes de résine époxy pour augmenter les propriétés de vieillissement thermique d'un système de résine durcie par réduction de la microfissuration telle que mesurée par une perte de poids réduite après vieillissement thermique. Cette invention concerne également une formulation de résine bismaleimide (BMI) qui est dépourvue de bismaleimide solide non dissoute mais qui conserve les mêmes propriétés mécaniques que les formulations de résine bismaleimide contenant des particules de bismaleimide solides boueuses.
Bongiovanni Christopher L.
Boyd Jack
Thai Bryan
Cytec Technology Corp.
Smart & Biggar
LandOfFree
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