Blends of ethylene copolymers for hot melt adhesives

Details Blends of ethylene copolymers for hot melt adhesives Blends of ethylene copolymers for hot melt adhesives

C - Chemistry, Metallurgy

09

J

C09J 123/08 (2006.01)

Patent

CA 2148353

Disclosed are hot melt adhesives comprising tackifier and a high M w, narrow MWD, narrow CD ethylene/alpha-olefin copolymer(s) and a low M w, narrow M WD, narrow MWD ethylene/alpha-olefin copolymer prepared with either supported or unsupported cyclopentadienyl derivatives of Group IV and catalysts for applications in hot melt adhesives, particularly in automotive product assembly, packaging and food packaging. These ethylene copolymers have an M w ranging from 20,000 to 100,000, an MWD of less than 6 and 3 to 17 mole percent comonomer, and composition distribution breadth in- dex above 70 percent. These ethylene copolymer blends have an M w ranging from 20,000 to 100,000 and an MWD of less than 6. In addition, the copolymer blends have comonomer mole percent ranging from 3 to 17.

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