E - Fixed Constructions – 04 – C
Patent
E - Fixed Constructions
04
C
E04C 2/26 (2006.01) E04B 1/86 (2006.01) E04B 9/04 (2006.01) E04F 13/08 (2006.01) E04F 13/14 (2006.01)
Patent
CA 2567461
Openings in a board building material are formed by a large number of recesses (13) or by through-holes (12) and the recesses (13). The bottom surface (16) of each recess (13) is formed as a surface into which an engagement member (70) can be screwed or driven. The color of the bottom surfaces of the recesses is set to brightness relatively lower than the brightness of the color of a board surface (18). The base material of the board building material is a gypsum board, and the bottom surfaces of the recesses are formed by gypsum board base paper. In such a board building material, the region in which the engagement members are screwed or driven can be secured without impairing regularity, uniformity, or design features of the openings, and in addition, puttying etc. of portions where the engagement members are exposed can be eliminated.
Des ouvertures dans un matériau de construction de panneaux sont formées par un grand nombre de retraits (13) ou bien par des trous traversants (12) et les retraits (13). La surface inférieure (16) de chaque retrait (13) est formée comme surface dans laquelle un élément d'engagement (70) peut être vissé ou enfoncé. La couleur des surfaces inférieures des retraits a une luminosité relativement plus faible que celle de la couleur d~une surface de panneau (18). Le matériau de base du matériau de construction de panneaux est un panneau de gypse, et les surfaces inférieures des retraits sont formées par un papier de base de panneau de gypse. Dans un tel matériau de construction de panneaux, la région dans laquelle on visse ou on enfonce les éléments d~engagement peut être fixée sans compromettre la régularité, l~uniformité ou les caractéristiques de conception des ouvertures, et l~on peut en outre supprimer le masticage, etc., de portions dans lesquelles les éléments d~engagement sont exposés.
Amagai Yasuyuki
Hasegawa Tomoya
Okazaki Shoichi
Wada Masahiro
Sim & Mcburney
Yoshino Gypsum Co. Ltd.
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