H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12
H05K 1/02 (2006.01) H05K 3/34 (2006.01) H05K 1/11 (2006.01)
Patent
CA 1253259
SUMMARY: Board for printed circuits and processes for manufacturing such printed circuit boards. On a printed circuit board, in which the substrate (1) and interconnections (2) are masked by a solder-resis- tant lacquer mask consisting of two layers of lacquer (4,5), the lands (3) being left unmasked, one layer of lacquer (4), which extends to the edges of the lands (3) and directly masks the substrate (1), is provided at least in the region of the lands (3), and the other layer of lacquer (5) masks the interconnections (2), whilst leaving the lands (3) unmasked, and extends to the region occupied by the layer of lacquer (4) extending to the edges of the lands (3), the two layers overlapping (Fig. 6). Two processes are proposed for the manufacture of such a printed circuit board.
532336
Fetherstonhaugh & Co.
Koninklijke Philips Electronics N.v.
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