Board-level emi shield with enhanced thermal dissipation

Details Board-level emi shield with enhanced thermal dissipation Board-level emi shield with enhanced thermal dissipation

H - Electricity

05

K

H05K 9/00 (2006.01) H01L 23/552 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2481842

A substrate (10) having at least one electrical component (11) disposed thereon; a plurality of discrete electrically conductive fastening units (14) disposed in a pattern on the substrate surrounding the at least one electrical component; a board-level electromagnetic interference (EMI) shield (20) comprising an electrically conductive layer (26); a plurality of apertures (23) formed in the board-level EMI shield (20) such that the apertures (23) correspond to the pattern of the electrically conductive fastening units (14); with at least one thermally conductive interface (TCI) material (40) disposed over the at least one electrical component; and wherein the electrically conductive layer (26) of the board-level EMI shield is in electrical contact with at least one electrically conductive fastening unit (14).

L'invention concerne un dispositif comprenant : un substrat (10) surmonté d'au moins au composant électrique (10) ; une pluralité d'unités de fixation (14) électroconductrices discrètes disposés selon une configuration spécifique sur le substrat de façon à entourer le(s) composant(s) électrique(s) ; un blindage (20) sur carte contre les interférences électromagnétiques (EMI) comprenant une couche électro-conductrice (26) ; une pluralité d'ouvertures (23) ménagées dans le blindage (20) EMI sur carte de façon à correspondre à la configuration des unités de fixation (14) électro-conductrices ; au moins un matériau (40) interfacial thermoconducteur (TCI) disposé sur le(s) composant(s) électrique(s). Selon l'invention, la couche électroconductrice (26) du blindage EMI sur carte est en contact électrique avec au moins une unité de fixation (14) électroconductrice.

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