Board to board interconnect

Details Board to board interconnect Board to board interconnect

H - Electricity

05

K

H05K 3/36 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2268294

A board-to-board interconnect socket provides electrical interconnection between printed circuit boards. Resilient metalized particle interconnects are disposed in holes in a rigid substrate of desired thickness. Each resilient interconnect includes first and second cap members that extend from opposing ends of the hole and beyond the respective surfaces of the substrate. The first and second cap members may be connected with a stem member or conductive paste that is disposed inside the hole. The hole may be lined with conductive material such as conductive plating to facilitate conduction of electricity.

Affiliated with

Also associated with

Rating

Board to board interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Board to board interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Board to board interconnect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1882947