Bond wire transmission line

Details Bond wire transmission line Bond wire transmission line

H - Electricity

05

K

356/9

H05K 1/02 (2006.01) H01L 23/66 (2006.01) H01L 25/16 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1239483

-12- BOND WIRE TRANSMISSION LINE ABSTRACT A bond wire connection between two semicon- ductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.

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