Bondable polyamides

Details Bondable polyamides Bondable polyamides

C - Chemistry, Metallurgy

08

G

402/225, 402/234

C08G 18/34 (2006.01) C08G 69/26 (2006.01) H01B 3/30 (2006.01)

Patent

CA 1211248

BONDABLE POLYAMIDES ABSTRACT OF THE DISCLOSURE Self bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms and a monocarboxylic acid. These self bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g., a polyester, polyester- imide, or polyamide-imide.

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