Bonded can and process for preparation thereof

B - Operations – Transporting – 65 – D

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

190/84, 154/53.1

B65D 1/40 (2006.01) B65D 3/30 (2006.01) B65D 23/00 (2006.01) B65D 25/00 (2006.01) B65D 53/00 (2006.01)

Patent

CA 1102260

Abstract of the Disclosure A bonded can having a structure formed by lap- bonding a can blank composed of a tin-free steel by a polyamide type adhesive, herein the can blank comprises in the lap-bond portion an interposing adhesive layer composed of an epoxy resin and a polycyclic polyhydric phenol-containing phenol-aldehyde resin, the can blank comprises an anti-corrosion protecting coating layer composed of a thermosetting resin different from the resin of the interposing adhesive layer at least on the inner face of a portion other than the lap-bond portion, and the protecting coating layer has a gel proportion of at least 70 % as measured by extraction in 60°C. chloroform for 60 minutes. - 1 -

318918

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Bonded can and process for preparation thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonded can and process for preparation thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonded can and process for preparation thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-474411

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.