Bonded can and process for preparation thereof

Details Bonded can and process for preparation thereof Bonded can and process for preparation thereof

B - Operations, Transporting

65

D

190/84, 154/53.1

B65D 8/16 (2006.01) B65D 3/22 (2006.01)

Patent

CA 1126670

Abstract of the Disclosure A bonded can having a structure formed by lap- bonding a can blank composed of a tin-free steel by a polyamide type adhesive, wherein the can blank comprises in the lap-bonded portion an interposing adhesive layer composed of an epoxy resin and a polycyclic phenol- containing phenol-aldehyde resin, the can blank comprises an anti-corrosion protecting coating layer composed of a thermosetting resin at least on the inner face of a portion other than the lap bond portion, and the thickness Ta of the interposing adhesive layer and the thickness Tp of the protecting coating layer satisfy the following requirements: Ta/Tp = 0.025 to 0.7, Ta = 0.5 to 9 microns, and Tp = 3 to 20 microns.

319001

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