B - Operations – Transporting – 21 – D
Patent
B - Operations, Transporting
21
D
400/5423, 190/84
B21D 51/26 (2006.01) C09D 3/56 (1980.01) C09D 3/58 (1980.01)
Patent
CA 1098636
Abstract of the Disclosure A bonded can having a high hot water resistance, which consists of a metal material having both the confronting side edges bonded together by a linear polyamide adhesive through an epoxy-phenolic resin undercoating composition, wherein said epoxy-phenolic resin undercoating composition comprises 50 to 95 % by weight of an epoxy resin having a number average molecular weight of 800 to 5500, which is obtained by condensation of an epihalohydrin with bisphenol A, and 5 to 50 % by weight of a resol-type phenol-aldehyde resin having a number average molecular weight of 200 to 1000, which is obtained by reacting a mixed phenol comprising 65 to 98 % by weight of a dihydric phenol represented by the following general formula: - 1 - Image wherein R stands for a bridging group or is a direct bond, and 2 to 35 % by weight of a monohydric phenol, with an aldehyde in the presence of a basic catalyst. This bonded can can retort retort sterilization conducted at 122 to 135°C without substantial reduction of the peel strength of the bonded portion. - 1 -
297257
Kobayashi Seishichi
Mori Tatsuo
Ueno Hiroshi
Smart & Biggar
Toyo Seikan Kaisha Ltd.
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