Bonded pin extrusion die and method

Details Bonded pin extrusion die and method Bonded pin extrusion die and method

B - Operations, Transporting

23

P

B23P 15/00 (2006.01) B28B 3/20 (2006.01)

Patent

CA 2188640

A honeycomb extrusion die and a method of making the die are disclosed, the die being made by bonding a die discharge section formed as a separate pin array to a separate die body incorporating an array of feed channels, the pin array comprising a plurality of pins attached to and extending outwardly from a body-compatible pin support which is removed after bonding the pins to the body. The pins may be formed of hard wear materials, and may have any of a variety of cross-sectional shapes adapted to improve extrusion uniformity as well as to form honeycomb cells of a variety of different cross-sectional shapes.

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