Bonded wafer avalanche photodiode and method for...

H - Electricity – 01 – L

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H01L 31/18 (2006.01) H01L 31/107 (2006.01)

Patent

CA 2643938

An avalanche photodiode includes a high quality electrooptically active substrate, a handle substrate bonded to the active substrate, and an avalanche photodiode active area formed in the high quality electrooptically active substrate including a high field region for generating avalanche current gain. By using a handle wafer bonded to the active substrate, the avalanche photodiode of the subject invention has a greater strength and thickness without the reduction of desirable electrical characteristics.

L'invention concerne un photodiode à avalanche comprenant un substrat électro-optiquement actif de qualité élevée, un substrat de manipulation lié au substrat actif et une zone active de photodiode à avalanche formée dans le substrat électro-optiquement actif de qualité élevée comprenant une région à champ élevé permettant de générer un gain de courant d'avalanche. Par l'utilisation d'une tranche de manipulation liée au substrat actif, la photodiode à avalanche de la présente invention a une résistance et une épaisseur supérieure sans réduction des caractéristiques électriques désirables.

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