Bonding a diamond compact to a cemented carbide substrate

B - Operations – Transporting – 24 – D

Patent

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B24D 3/18 (2006.01) C04B 37/02 (2006.01)

Patent

CA 2260334

A method of bonding a diamond compact comprising a polycrystalline mass of diamond and a bonding phase which contains free-silicon to a substrate is provided. The method includes the steps of contacting a surface of the compact with carbon or nitrogen or a mixture thereof under conditions suitable to cause free-silicon in the surface to react with the carbon and/or nitrogen and thereafter bonding that surface to the substrate, preferably by means of a braze. In a preferred form of the invention, the surface which is bonded to the substrate is acid cleaned after contact of that surface with carbon or nitrogen or a mixture thereof.

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