Bonding apparatus for cutting label continuum having labels...

B - Operations – Transporting – 65 – C

Patent

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Details

B65C 9/36 (2006.01) B65C 9/18 (2006.01) B65C 9/25 (2006.01) B65C 9/46 (2006.01)

Patent

CA 2172306

A bonding apparatus for bonding a label of a label continuum to an object comprising a first feeding means for feeding the label continuum; a cutting means for cutting the label continuum fed by the first feeding means to a plurality of label strips each having a predetermined length; a second feeding means which has a contact surface having a configuration not easily bonded to w n adhesive layer of the label strip formed by cutting the label continuum by the cutting means and feeds the label strip to a bonding position at which the label strip is bonded to the object, by holding the label strip on the contact surface thereof; a feeding means, for feeding the object, formed in proximity to the second feeding means; and a printing means, for performing printing on the label strip fed by the second feeding means, formed in proximity to the bonding position at which bonding of the label strip to the object fed by the feeding means starts.

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