Bonding materials

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 161/24 (2006.01) B27N 3/00 (2006.01) C08K 9/10 (2006.01) C08L 61/24 (2006.01) C08L 91/06 (2006.01) C08L 97/02 (2006.01)

Patent

CA 2271741

A formaldehyde-based polycondensation resin bonding composition and method for forming shaped ligno-cellulosic materials wherein an active agent which is at least one of a hardener for the bonding material, a flame/fire retardant or a water absorbent is encapsulated using an encapsulant which degrades to release contents of the capsules at a temperature above that prevailing in the system prior to application of heat in the final hot-pressing stage.

Cette invention concerne une composition adhésive de résine obtenue par polycondensation et à base de formaldéhyde, ainsi qu'un procédé de production de matériaux ligno-cellulosiques mis en forme. A cette fin, un agent actif consistant en un durcisseur du matériau adhésif, en un ignifuge contre les flammes/le feu et/ou en un produit absorbant l'eau, est encapsulé à l'aide d'un agent d'encapsulation. Ce dernier est capable de se dégrader de manière à libérer le contenu des capsules à une température supérieure à celle régnant dans le système, ceci avant d'appliquer une chaleur donnée lors de l'étape finale de pressage à chaud.

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