Bonding method

Details Bonding method Bonding method

C - Chemistry, Metallurgy

09

J

402/187, 117/30,

C09J 5/06 (2006.01) C09J 7/02 (2006.01)

Patent

CA 1091844

ABSTRACT OF THE DISCLOSURE A method is disclosed for forming a strong bond between a substrate and a solid thermoplastic polymer which comprises melting a thermoplastic poly- mer having an effective open time (a period after melting the polymer during which it remains aggressively tacky and bondable below the melting temperature),cooling it below the melting temperature, contacting the open polymer with a substrate and allowing the polymer to revert to its non-bondable, solid state. Also disclosed are a class of polyesters suitable for use in the method and certain novel articles adapted for carrying out the method.

254122

Affiliated with

Also associated with

Rating

Bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1025777