Bonding method of semiconductor device

Details Bonding method of semiconductor device Bonding method of semiconductor device

H - Electricity

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356/164

H01L 21/461 (2006.01) H01L 21/603 (2006.01) H01L 23/485 (2006.01)

Patent

CA 1240410

ABSTRACT A bonding method of semiconductor device by using a film carrier; A heat resistive insulating layer is deposited all over the surface of a dummy wafer on which a photo-resist film having a predetermined pattern is previously formed; The photo-resist film is removed together with the heat-resistive insulating layer for forming openings; Bumps are formed on the openings by planting using the heat-resistive insulating layer as a mask; after transferring the bumps to inner leads, the bumps of the inner leads are bonded to bonding pads of the semiconductor element.

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