Bonding methods and laminates

Details Bonding methods and laminates Bonding methods and laminates

B - Operations, Transporting

01

J

252/38, 154/107.

B01J 35/04 (2006.01) B01J 35/06 (2006.01) B32B 7/12 (2006.01) C09J 4/06 (2006.01) C09J 5/00 (2006.01)

Patent

CA 1148921

ABSTRACT The invention provides improved bonding methods and bonded laminates using multi-part adhesive compositions having first and second parts. The first part or the adhesive composition comprises free radical polymerizable monomers and a source of free radicals; the second part comprises an activator for initiation of polymerization of the monomer. According to the invention, flexible, activator carrying elements are positioned between layers of the first part to provide effective bonding between substrate surfaces which may be spaced apart from each other by relatively large gaps.

334022

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