B - Operations – Transporting – 23 – P
Patent
B - Operations, Transporting
23
P
B23P 19/02 (2006.01) F16B 11/00 (2006.01) H01M 2/14 (2006.01)
Patent
CA 2272115
A method of bonding adjacent generally planar surfaces of two metal workpieces involves treating at least the surface of that workpiece formed of the harder metal, or the surface of at least one of the workpieces if equally hard, by gouging out of the surface an array of outwardly pointing integral burrs, bringing the surfaces into adjacency with a pressure fluent layer of settable bonding material therebetween; applying sufficient pressure across the surface to cause substantial deformation of the metal of at least one of the workpieces in contact with the metal of the other workpiece at the points where the burrs of one workpiece surface contact the other workpiece such as to provide metal-to-metal contact within the bonding material layer, and setting the layer of bonding material.
Bondface Technology Inc.
Mackelvie Winston R.
Na
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