Bonding of polymide films, and printed circuit boards

Details Bonding of polymide films, and printed circuit boards Bonding of polymide films, and printed circuit boards

C - Chemistry, Metallurgy

08

J

C08J 5/12 (2006.01) C08G 59/50 (2006.01) C09J 161/20 (2006.01) C09J 163/00 (2006.01) H05K 3/38 (2006.01) H05K 1/00 (2006.01)

Patent

CA 2042153

ABSTRACT OF THE DISCLOSURE An adhesive having a content of a thermically curable oxa- zene resin which contains at least one 1-oxa-3-aza tetraline group in the molecule, optionally in combination with at least one curable epoxy compound, is used for bonding polyimide films to films of the same kind or to other substrates, particularly metal foils. Such bondings are highly heat-resistant and have an excellent peeling resistance. Therfore, they are suitable for the manufacture of printed circuit boards having high ther- mal stability and peeling resistance.

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