Bonding process for grinding tools

Details Bonding process for grinding tools Bonding process for grinding tools

B - Operations, Transporting

24

D

204/19

B24D 3/06 (2006.01) B24D 18/00 (2006.01) C25D 5/12 (2006.01) C25D 15/00 (2006.01)

Patent

CA 1143692

Abstract of Disclosure A dual bonding process to make single layered tools wherein a metallic workpiece is pre-etched so as to form cavities in the surface of the workpiece for individually receiving diamond or other abrasive particles to be bonded thereto. The diamond particles are uniformly deposited and densely bonded to the surface of said metallic workpiece by a metallic bonding matrix applied in a first plating bath. A second selective plating of metal applied in a second plating bath more securely bonds the diamonds to the workpiece and provides the workpiece with a predetermined hardness for any selected grinding or cutting application. In order to make multilayered tools, this dual bonding process may be repeated for each layer applied.

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