Bonding process using curable epoxide resin adhesive

Details Bonding process using curable epoxide resin adhesive Bonding process using curable epoxide resin adhesive

B - Operations, Transporting

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B32B 7/12 (2006.01) C08G 59/18 (2006.01) C08G 59/40 (2006.01) C08G 59/68 (2006.01) C09J 5/00 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1259897

Case 3-15309/+/B/ARL 360 ABSTRACT BONDING PROCESS USING CURABLE EPOXIDE RESIN ADHESIVE Adhesion between surfaces of metal, reinforced plastics, glass, friction material or ceramics is effected using an adhesive comprising a) an epoxide resin b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide, isophthalic acid dihydrazide or adipic acid dihydrazide, and c) as accelerator for the cure, and dispersed as a powder in a) and b), a solid solution of a nitrogen base having a boiling point-above 130°C and a phenol-aldehyde resin. Typical nitrogen bases used in c) include benzyldimethyl- amine, benzimidazole and 2-methylimidazole. Typical phenolic resins are those prepared from phenol and formaldehyde.

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